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LSD is disabled (Likely due to a bug see § Front-end for details).

All the changes from Skylake Client (For full list, see Skylake (Client) § Key changes from Broadwell).Limits motherboard trace design to 7 inches max from (down from 8) from the CPU to chipset.Increase in transfer rate from 5.0 GT/s to 8.0 GT/s (~3.93GB/s up from 2GB/s) per lane.Sub-NUMA Clustering (SNC) support (replaces the Cluster-on-Die (COD) implementation).Improved "14 nm+" process (see Kaby Lake § Process Technology).Those chips also have an entirely new multi-core system architecture that brought a new mesh interconnect network (from ring topology). Unlike client models, Skylake servers and HEDT models will still incorporate the fully integrated voltage regulator (FIVR) on-die. Skylake server configuration introduces a number of significant changes from both Intel's previous microarchitecture, Broadwell, as well as the Skylake (client) architecture. Unlike mainstream Skylake models, all Skylake server configuration models are fabricated on Intel's enhanced 14+ nm process which is used by Kaby Lake. Process Technology Main article: 14 nm lithography process Skylake-based Core X was introduced in May 2017 while Skylake SP was introduced in July 2017.

Mid-range performance / Efficient lower power Intel introduced a number of new server chip families with the introduction of Skylake SP as well as a new enthusiasts family with the introduction of Skylake X.